1-4 September, 2006 Pragati Maidan, New Delhi, India
    . `The Grassroots Tour`


The half-day conference was a “sampler” of what would be presented at PackAge 2007- the international conference that will be held concurrently with the August exhibition. The theme was “Packaging & Converting: Gearing Up For The Retail Revolution”. In the identical conference in the three venues the first paper was entitled “Closures & Caps: New Developments” and it was presented by Prabal Chakraborti Sales Manager of Bericap India, the country's leading manufacturer of caps and closures. He explained the basic concepts in development of closures and elaborated on Bericap's recent product introductions in tamper-evident, user-friendly and child-resistant closures.

Harish Madan, Mg. Dir. of SnS Containers, then talked about “Corrugated Packaging: Overview & Trends”. He traced the history of corrugated packaging in India, its present status and the way it was headed. He also drew a comparison with the rapid progress made by China in recent years.

Harveer Sahni, Managing Director of Weldon Celloplast, India's leading labelstock manufacturer presented a paper on “Practical Solutions for Brand Security” where he highlighted the need to protect brands against the global menace of counterfeiting. He laid out the various techniques and devices available like substrate solutions, holograms, taggants, ink-based solutions, RFID etc. and mentioned that the best approach was to use a combination of several overt and covert devices and to keep changing them to stay ahead of counterfeiters.
Avinash Bangale, Mico Bosch, talked about “Continuous Motion Vertical Form, Fill & Seal Machines” and its advantages over intermittent machines. He spoke about the significant price/space saving for total production line including up- and downstream equipment besides the savings in operator costs.

S. Chidambar, an industry consultant, then presented the concluding paper on behalf of Uflex (formerly Flex Industries) on “The Indian Flexible Packaging Market” with particular emphasis on recent developments in metallised films (like plasma-enhanced metallising) which have emerged as the best high-barrier options in flexible packaging.

The tabletop exhibition at the three centers was made up with twenty six leading Indian companies and included Ajanta Packaging, Baumer India Pvt. Ltd., Bericap India, Borkar Packaging Pvt. Ltd., Creed Engineerings Pvt Ltd., ELGI Equipments Limited, Flexo (Image) Graphics Pvt Ltd., Great Eastern Impex Pvt Ltd., Hindustan Adhesive Ltd., Hi-Glo Holo Images Pvt Ltd., IPP Group, Label Planet., Millenium Packaging Solutions, MICO (Bosch), Natraj Corrugation Co., P G Foils Ltd., Packolabel Systems Pvt Ltd, Pidilite Industries, Shrink Packaging Systems, SnS Containers, Stapware, Vishal Holo Solutions (P) Limited, Weldon Celloplast Ltd., Wimco Ltd., Uflex Pvt. Ltd., JRM Sales and Micro Inks etc.

“This has been a unique experience for us. This is the first time that we have participated in the India Package Meet and have gathered several serious enquiries over the last three days. We shall look forward to the next round of such meets,” said Prabal Chakraborti of Bericap India echoing the sentiments of the twenty seven satisfied exhibitors.



Date: 16-Jul-2007

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